This peel tester is designed for measuring peel and adhesive strength of films, adhesive tapes, and thicker samples at an angle close to 180 degrees. The clamp jig allows quick, one-touch sample fixation, making it suitable for applications such as copper foil peeling on printed circuit boards.

With a maximum peeling speed of 1500 mm/min, it is also ideal for studying peeling characteristics at different speeds. The Next Series (firmware version 5 or later) ensures greater measurement stability with reduced noise, easy expandability through downloadable functions on IMADA-Connected.com, and convenient access to software and manuals. Models are available with measurement capacity up to 20N or 50N.

Tags: Hi Speed Peel Test, Single Touch, Incl Software, Mid-Lo Force